Invisible cutting application technology
Stealth cutting is a cutting method that focuses the laser on the inside of the workpiece, forms a modified layer inside...
Meet the requirements of ultra-high precision micromachining technology in the semiconductor industry, and is committed to providing professional laser processing solutions and cost-effective technical support services for high-end advanced chip manufacturing. We are committed to R & D, production and sales of ultra precision laser equipment for various industrial applications, mainly used in semiconductor wafer manufacturing, packaging and testing, consumer electronics and other related processing fields.
Stealth cutting is a cutting method that focuses the laser on the inside of the workpiece, forms a modified layer inside...
The low-k film applied to the insulating film of high-speed logic components has low mechanical strength. If ordinary bl...
Compound semiconductors such as GaAs (gallium arsenide) are used in high frequency devices. When using the existing diam...
With scientific management, excellent technology, standardized production, perfect service and good reputation as the guarantee, we are determined to become a company with independent intellectual property rights and relatively strong core competitiveness.
Cooperate with us to restore the appearance of your product blueprint!
Contact us
Tel：18651420821
Email：lumi_server@lumilaser.com
Address：Building 4, Northwest District, nano City, No. 99, Jinjihu Avenue, Suzhou Industrial Park
Copyright © 2018 lumi laser. All rights reserved. Suzhou Laiming Laser Technology Co., Ltd ICP：苏ICP备2021045377-1
Home
Telephone
Message
