Laser debonding-Suzhou Lumi Laser Technology Co., Ltd.

Solution

Meet the requirements of ultra-high precision micromachining technology in the semiconductor industry, and is committed to providing professional laser processing solutions and cost-effective technical support services for high-end advanced chip manufacturing. We are committed to R & D, production and sales of ultra precision laser equipment for various industrial applications, mainly used in semiconductor wafer manufacturing, packaging and testing, consumer electronics and other related processing fields.

Invisible cutting application technology

Stealth cutting is a cutting method that focuses the laser on the inside of the workpiece, forms a modified layer inside...

More possibilities in the future

With scientific management, excellent technology, standardized production, perfect service and good reputation as the guarantee, we are determined to become a company with independent intellectual property rights and relatively strong core competitiveness.