Centrifugal cleaning machine
Model:Laser Grooving LFL-AB1200
Scope of application:Wafer, CMOS body, substrate, CCD shell powder, impurity holder, Holder + IR, lens, VCM and other removal operations
Model:Laser Grooving LFL-AB1200
Scope of application:Wafer, CMOS body, substrate, CCD shell powder, impurity holder, Holder + IR, lens, VCM and other removal operations
It has the characteristics of high cleaning efficiency, simple operation and good cleaning effect. Reliable quality and convenient after-sales service.
01. The cleaning plate can be replaced to clean a variety of products, and the cleaning plate products are customized
02. The equipment is easy to operate and more humanized
03. The equipment adopts two fluid cleaning, with high cleaning accuracy, zero damage to the product and minimal pure water consumption
04. Rotary spray bar to avoid secondary pollution of products
05. High speed centrifugal design, speed adjustable 100-3000r / min
06. Equipped with electrostatic elimination device, cavity closed heating device, auxiliary cleaning to achieve the best effect
07. Equipped with two-stage air filtration system, the compressed air complies with ISO8573 1 standard
08. Space saving design with reduced width to reduce the occupied area of dust-free workshop
09. The whole machine is made of stainless steel body, which can withstand acid and alkali, has no pollution to the working environment, and the mirror shell equipment maintenance is easy to clean
10. Completely use ultrapure water for cleaning, meeting Rosh standard
Laser power | ≥15W(Measured about 18W) | ||
Y-axis of linear motor | Stroke: 450mm | Stepping:1um | Resolution:1um |
X-axis of linear motor | Stroke: 650mm | Stepping:1um | Resolution:1um |
Z axis | Stroke: 20mm | Stepping:1um | Resolution:1um |
θ axis | Stroke: 270° | Stepping:0.001° | Resolution:0.001° |
Machining dimension | Maximum 12inch (300mm) | ||
Scribing mode | Full cut / surface grooving |
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