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昆山Automatic silicon wafer invisible cutting equipment

Model：Laser Grooving LFL-AB1200

Scope of application：MEMS、RFID、Image sensor

Introduce

Laser stealth cutting is a cutting method that focuses the laser on the inside of the silicon wafer, forms a modified layer inside the silicon wafer, and divides the workpiece into chips by expanding the adhesive film.

Advantage

01. Anhydrous process

02. No dust

03. Fast cutting speed

04. Zero cutting loss

05. High wafer strength after cutting

06. Direct cutting of ultra-thin round crystals

07. No static electricity is generated during cutting

Parameter

Laser power	≥15W（Measured about 18W）
Y-axis of linear motor	Stroke: 440mm	Stepping：1um	Resolution：1um
X-axis of linear motor	Stroke: 700mm	Stepping：1um	Resolution：1um
Z axis	Stroke: 20mm	Stepping：1um	Resolution：1um
θ axis	Stroke: 220°	Stepping：0.001°	Resolution：0.001°
Machining dimension	Maximum 12inch (300mm)
Scribing mode	SD implicit cut