昆山Automatic laser debonding equipment

昆山Automatic laser debonding equipment

Model:Laser Grooving LFL-AB1200

Scope of application:Lowk wafer, Gan wafer, non low k wafer

Consultation

Introduce

With the continuous improvement of chip integration, the linewidth is getting smaller and smaller, and RC delay and crosstalk noise have become prominent problems. When the linewidth required by the process is less than 65nm, lon-k layer with low dielectric constant must be used to solve the above problems. Because it is difficult to use ordinary diamond grinding wheel for cutting, sometimes it can not meet the processing standards required by electronic component manufacturers. Therefore, the engineers of Suzhou radium laser technology Co., Ltd. have developed processing application technology that can solve this problem.

Advantage

01. DPSS laser

02. Low damage and high yield

03. High precision and high speed debonding system

04. Spot detection and power feedback

05. Machinable size: 8inch and 12inch

06. Provide a complete set of solutions including bonding materials, processes and lasers

Parameter


Laser power≥15W(Measured about 18W)
Y-axis of linear motorStroke: 450mmStepping:1umResolution:1um
X-axis of linear motorStroke: 650mmStepping:1umResolution:1um
Z axisStroke: 20mmStepping:1umResolution:1um
θ axisStroke: 270°Stepping:0.001°Resolution:0.001°
Machining dimensionMaximum 12inch (300mm)
Scribing modeFull cut / surface grooving


Design sketch

切割效果.jpg

相关标签:硅晶圆

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