With the continuous improvement of chip integration, the linewidth is getting smaller and smaller, and RC delay and crosstalk noise have become prominent problems. When the linewidth required by the process is less than 65nm, lon-k layer with low dielectric constant must be used to solve the above problems. Because it is difficult to use ordinary diamond grinding wheel for cutting, sometimes it can not meet the processing standards required by electronic component manufacturers. Therefore, the engineers of Suzhou radium laser technology Co., Ltd. have developed processing application technology that can solve this problem.

01. Double cutting optical path

02. Cutting width 8-70 μ M continuously variable

03. Independently designed optical system

04. High productivity and stability