With the continuous improvement of chip integration, the linewidth is getting smaller and smaller, and RC delay and crosstalk noise have become prominent problems. When the linewidth required by the process is less than 65nm, lon-k layer with low dielectric constant must be used to solve the above problems. Because it is difficult to use ordinary diamond grinding wheel for cutting, sometimes it can not meet the processing standards required by electronic component manufacturers. Therefore, the engineers of Suzhou radium laser technology Co., Ltd. have developed processing application technology that can solve this problem.

01. DPSS laser

02. Low damage and high yield

03. High precision and high speed debonding system

04. Spot detection and power feedback

05. Machinable size: 8inch and 12inch

06. Provide a complete set of solutions including bonding materials, processes and lasers